Introduction to bakelite suction nozzles: Bakelite suction nozzles, also known as bakelite suction tips or padwood suction tips, are similar to tungsten steel suction nozzles and are the main tools used by LED automatic die bonding machines to pick up wafers and IC bare chips. They come in specifications ranging from 2mil, 3mil, 4mil, 5mil, 6mil, 8mil, 10mil, and up to 30mil, with different inner diameters. They are also available in lengths of 14mm, 16mm, and 17mm. When producing deep cup supports, VR bakelite suction nozzles can be used first. The VR parameters are generally VR=0.5-0.8mm. When selecting products, it can be determined based on the model of the automatic die bonding machine and the products being produced.